Manufacturing Equipment: Twin Dicing System Machines & Wire Bonders
F&S Bondtec | ADT | Exatron | Infotech Automation | centrotherm | Deweyl
MANUFACTURING EQUIPMENT
F&S Bondtec Austria serves the desktop equipment segment and supplies the most complete program worldwide for bonding and testing equipment. Only F&S Bondtec Austria can offer you a secure investment into the future: our Desktop-Micro-Factory which provides all wire bond processes and, in addition, all test methods in a single desktop machine base.
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The Desktop Micro Factory, the series 56XX, is completely without competition on the world market. No other supplier even comes close to offering the features of this bonder: all wire bond processes on a single machine thanks to exchangeable bond heads; convertibility to pull and shear testers; programmable for fully automatic operation and optional pattern recognition unit.
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Advanced Dicing Technologies (ADT) is specialized in the development and manufacturing of saws, blades and processes used in the dicing of ICs, package Singulation, Glass, Ceramic, Quartz, PZT and other Microelectric Components. Our Peripheral Equipment includes Tape Curing, Wafer mounting, Wafer Cleaning, Spindle Chillers, Resistivity Controls, Water Controls, Flanges and Dressing Boards.
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Fully Automatic Twin Dicing System
The ADT 8020 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice workpieces of up to 8-inch in diameter, at high performances and low cost of operation. Features and Benefits
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Exatron offers a complete line of automated handling, testing, programming, and laser marking equipment for the packaged integrated circuit industry. Device Handlers, Tape and Reel, MEMS Handlers, Laser Markers, Contactors and Pick and Place for device testing.
High-Precision Die Bonding Solutions by Infotech Automation
Infotech AG, a Swiss leader in advanced automation systems, excels in die bonding technology, offering industry-leading solutions tailored for precision assembly. Located in Solothurn, Infotech leverages 40 years of engineering expertise to deliver state-of-the-art machines designed for microelectronics, semiconductors, and beyond. What is Die Bonding? Die bonding involves attaching semiconductor chips, such as ASICs or MEMS, to substrates like ceramic boards, wafers, or other chips. Infotech’s Die Bonder stands out for its versatility and precision, supporting bonding techniques like flip-chip, eutectic, thermocompression, ultrasonic, and epoxy adhesive methods. This adaptability allows manufacturers to meet demanding assembly requirements in industries ranging from electronics to biotechnology. Key Features of Infotech’s Die Bonding Machines Infotech’s Die Bonders are universally configurable, ensuring seamless integration with existing production lines. They support multiple applications, including the placement and alignment of bare dice, sensors, photonic devices, and laser diodes. The machines also combine bonding tasks with micro-dispensing, enabling parallel operations to boost efficiency. One standout feature is the Hybrid Bonder, a flexible solution that merges traditional die bonding with surface-mount technology (SMT) processes. It handles components from various feed forms, including tapes and Gel-Paks®, making it indispensable for diverse production needs. Applications Across Industries Infotech’s die bonding solutions serve industries like:
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Die Bonder
Hybrid Bonder
IC Production Cells
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The centrotherm Vacunite system platform covers a wide range of vacuum soldering applications from process performance-based R&D processing up to high-volume production. The systems meet highest requirements of voidless soldering and fluxless soldering for Advanced Packaging and Power Semiconductor applications. The void-affected area can be reduced to less than 1% whereas common reflow soldering systems range at 20%.
Depending on the field of application Vacunite systems are available with single and multiple heating plates ensuring both, fast heat-up and cool-down rates for short cycle times and large processed area per hour while achieving temperatures up to 650 °C.
centrotherm Vacunite vacuum soldering systems allow processes under pure and oxygen-free atmospheres and provide surface activation with 100% Hydrogen (H2), For-mic Acid (HCOOH), Forming Gas (N2H2) and/or additional MW plasma. All systems are suited for 100% paste and flux.
The process control computer is equipped with a user- friendly touch screen for operating, process profile editing and recipe storing. Accessibility through Ethernet and USB interfaces allows connection with printers, external storage devices and remote access.
Depending on the field of application Vacunite systems are available with single and multiple heating plates ensuring both, fast heat-up and cool-down rates for short cycle times and large processed area per hour while achieving temperatures up to 650 °C.
centrotherm Vacunite vacuum soldering systems allow processes under pure and oxygen-free atmospheres and provide surface activation with 100% Hydrogen (H2), For-mic Acid (HCOOH), Forming Gas (N2H2) and/or additional MW plasma. All systems are suited for 100% paste and flux.
The process control computer is equipped with a user- friendly touch screen for operating, process profile editing and recipe storing. Accessibility through Ethernet and USB interfaces allows connection with printers, external storage devices and remote access.
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Conveyor Belt Furnace for High-Volume Production and R&D
The proven and reliable conveyor belt furnace c.FLEXCON is designed for all thick film applications. The muffle furnace provides a high process capability and ensures an economic and efficient production.
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Conveyor Belt Furnace for High-Volume Production and R&D
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Deweyl: DeWeyl Tool Inc. specializes in high-quality bonding tools tailored for precision applications in the semiconductor and electronics industries. Their product range includes wire bonding wedges, wire wedges, and ribbon bonding tools, all crafted to meet demanding performance standards across manual, semi-automatic, and automatic bonding equipment.
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Wire Bonding Wedges
DeWeyl offers both small and large wire bonding wedges suitable for a variety of applications. Small wire wedges are available in materials like tungsten carbide, titanium, and ceramic, providing solutions for standard and vertical feed bonding setups. These tools cater to both delicate microwave applications and robust automated processes. For large wire wedges, options include ceramic-tipped tools designed for durability and copper wire applications, ensuring long life and efficiency in high-demand environments Ribbon Bonding Wedges The ribbon bonding wedges are engineered for precision bonding of ribbon materials. These tools, available in tungsten carbide, titanium, and ceramic, often feature cross-groove designs to enhance grip and performance. DeWeyl also offers "double flat" ribbon wedges for deep-access bonding machines, further expanding usability across various equipment configurations. Vertical feed and A8D features provide additional customization to meet specific production requirements Customization and Innovation DeWeyl is committed to innovation, offering custom-designed bonding tools to address unique challenges. Their use of advanced materials and design features ensures compatibility with modern bonding technologies while delivering superior results in strength and reliability |
Large Wire Bonding Wedges
Standard & Vertical feed wedge options
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