Manufacturing Equipment: Twin Dicing System Machines & Wire Bonders
F&S Bondtec | ADT | Exatron | Air-Vac Automation | centrotherm | Deweyl
MANUFACTURING EQUIPMENT
F&S Bondtec Austria serves the desktop equipment segment and supplies the most complete program worldwide for bonding and testing equipment. Only F&S Bondtec Austria can offer you a secure investment into the future: our Desktop-Micro-Factory which provides all wire bond processes and, in addition, all test methods in a single desktop machine base.
|
The Desktop Micro Factory, the series 56XX, is completely without competition on the world market. No other supplier even comes close to offering the features of this bonder: all wire bond processes on a single machine thanks to exchangeable bond heads; convertibility to pull and shear testers; programmable for fully automatic operation and optional pattern recognition unit.
|
|
Advanced Dicing Technologies (ADT) is specialized in the development and manufacturing of saws, blades and processes used in the dicing of ICs, package Singulation, Glass, Ceramic, Quartz, PZT and other Microelectric Components. Our Peripheral Equipment includes Tape Curing, Wafer mounting, Wafer Cleaning, Spindle Chillers, Resistivity Controls, Water Controls, Flanges and Dressing Boards.
|
Fully Automatic Twin Dicing System
The ADT 8020 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice workpieces of up to 8-inch in diameter, at high performances and low cost of operation. Features and Benefits
|
|
Exatron offers a complete line of automated handling, testing, programming, and laser marking equipment for the packaged integrated circuit industry. Device Handlers, Tape and Reel, MEMS Handlers, Laser Markers, Contactors and Pick and Place for device testing.
Air-Vac Automation - Robotic Platforms and Automation Solutions including: Micro Dispense, Assembly, Sort, Package, Inspection, Test, Repair, Solder, Weld, Sealing, Micro Paint, Eutectic Bond , Jet Dispense and Power Module assembly.
|
Automated Material Handling
Trays: Loading and unloading systems are available for a variety of palettes such as 2” or 4” Waffle Trays, JEDEC Trays, and many others. The machine handling of palettes is extremely smooth and shock-free. We also offer customer specific solutions for non standard systems and for integration with in-line systems. Wafers with dies mounted on adhesive foil are fed to the machine on a fully-automated or semi-automated basis. Different frame types such as Disco, K&S, or ER expansion rings are supported. Magazines can be loaded to the front of the machine and wafers can be automatically loaded with machine actions to be performed on dies based on bin codes. |
|
|
|
Bonding | Die Attach
Several Bonding Processes are available - Eutectic/Thermo-Compression Bonding, Sintering, UV Curing Ovens, Bottom Heaters, Ultrasonic Bonding, In-Line Vacuum Ovens, Heated Bond-Heads, and more. We can combine these options with other stations, peripherals, and material handling options to meet your process needs. Process Parameters such as force, temperature, time, etc... are easily modified by the customer in the proprietary software. Additionally, there are several ways to verify & control the process - vision checks for melted solder, software checks for important process parameters, traceability reports, etc... |
The centrotherm Vacunite system platform covers a wide range of vacuum soldering applications from process performance-based R&D processing up to high-volume production. The systems meet highest requirements of voidless soldering and fluxless soldering for Advanced Packaging and Power Semiconductor applications. The void-affected area can be reduced to less than 1% whereas common reflow soldering systems range at 20%.
Depending on the field of application Vacunite systems are available with single and multiple heating plates ensuring both, fast heat-up and cool-down rates for short cycle times and large processed area per hour while achieving temperatures up to 650 °C.
centrotherm Vacunite vacuum soldering systems allow processes under pure and oxygen-free atmospheres and provide surface activation with 100% Hydrogen (H2), For-mic Acid (HCOOH), Forming Gas (N2H2) and/or additional MW plasma. All systems are suited for 100% paste and flux.
The process control computer is equipped with a user- friendly touch screen for operating, process profile editing and recipe storing. Accessibility through Ethernet and USB interfaces allows connection with printers, external storage devices and remote access.
Depending on the field of application Vacunite systems are available with single and multiple heating plates ensuring both, fast heat-up and cool-down rates for short cycle times and large processed area per hour while achieving temperatures up to 650 °C.
centrotherm Vacunite vacuum soldering systems allow processes under pure and oxygen-free atmospheres and provide surface activation with 100% Hydrogen (H2), For-mic Acid (HCOOH), Forming Gas (N2H2) and/or additional MW plasma. All systems are suited for 100% paste and flux.
The process control computer is equipped with a user- friendly touch screen for operating, process profile editing and recipe storing. Accessibility through Ethernet and USB interfaces allows connection with printers, external storage devices and remote access.
|
Conveyor Belt Furnace for High-Volume Production and R&D
The proven and reliable conveyor belt furnace c.FLEXCON is designed for all thick film applications. The muffle furnace provides a high process capability and ensures an economic and efficient production.
|
Conveyor Belt Furnace for High-Volume Production and R&D
|
| |||
|
Deweyl: Standard as well as Custom/High quality bonding wedges. The wedges are made from ceramic, titanium and Tungsten Carbide. They are used in bonding aluminum, gold, copper and platinum wires.
|
|
High quality bonding wedges for the microelectronic industry:
DeWeyl Tool offers a wide range of Small Wire bonding tool solutions for Manual, Semi-Automatic and Automatic bonding equipment. A minimum of three material choices are available: Tungsten Carbide, Titanium and Ceramic. Our CS series is the best choice for manual wire bonders and is especially useful for our microwave customers. Vertical Feed wedges are available where indicated. A wide range of Large Wire bonding tool solutions as well - Applications involving Large Wire typically consist of wire diameters of .003” (75 um) and larger, using Au, Al, Cu, and Pt. The CL style with a VG foot is most commonly used for automatic applications. For manual applications, the CS style with a GW foot is most common. Vertical Feed wedges are available where indicated. |
|
