Automation: Assembly Systems & Die Bonders

​Air-Vac Automation specializes in manufacturing highly flexible and customizable automation equipment. We have more than 1,600 systems installed worldwide and more than 36 years of experience.

Die-Attach Systems

Bonding:
  • Eutectic Bonding (AuSN, AuSi...)
  • Thermo-compression bonding
  • Ultrasonic Bonding of AU Bumped Dies
  • Ag Sintering & Die Tacking
  • Flip-Chip Bonding
  • Epoxy & Solder Paste Die Bonding
  • Application of Flux
  • Preform Attach
  • Hot Gas Rework
  • SMEMA Connect to In-Line Ovens
Further Options:
  • Wafer Ejection
  • Conveyor Systems
  • ​Preform Feeders
Die Attach Systems PDF
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File Type: pdf
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System Example: HYBRID PACKAGE ASSEMBLY​

Hybrid Packaging & multi-component assembly, dispense, pick and place
  • +/- 10µm @3sigma with possibility of <5µm accuracy
  • Fiducial Alignments, Custom Inspections, and Logic
  • Highly Flexible Programming and Customization
  • Pick, Place, Dispense, Bond, Cure, Inspect
  • Fully Automated Batch Processing
  • Full Process Control & Traceability

IN-LINE PRODUCTION LINE​

Multiple machines can be connected in-line to each other as well as to third party machines to form a complete production line. Individual production cells range from 900 mm up to 2,000 mm footprints. Small tabletop platforms are also available for lower volume production and R&D tasks. Systems are standard ISO 7, but can be configured down to ISO 6 cleanroom compatibility.​

​Die Sorting Systems

  • ​Automatic Material Handling Systems
  • Bulk Feed, Tray Feed, Wafer Feed Components down to 0.1mm
  • Wafer Map Import and Automatic Alignments
  • Kitting to waffle tray, gel pack, JEDEC, re-taping parts...
  • Treatment & Pre-Assembly of Kitted Parts
  • Highly Flexible and Custom Configurations
Kitting & Sorting Brochure
File Size: 2610 kb
File Type: pdf
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Dispensing Systems Brochure
File Size: 952 kb
File Type: pdf
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