F&K Delvotec ( www.fsbondtec.at and www.fkdelvotec.com ) manufactures wire bonding systems used in a wide variety of applications ranging from microchip interconnect, to Li-Ion battery cell modules for EV’s, to solar concentrator arrays. Aluminum, Copper or Gold, wire sizes range from 17 to over 500 microns. From small, manual table-top systems - to large industrial systems, F&K Delvotec wire bonders are used in a wide variety of industries including; Automotive, Medical, Space, Communications and many others. Highest quality, built in Germany and Austria.
Advanced Dicing Technologies (ADT) is specialized in the development and manufacturing of saws, blades and processes used in the dicing of ICs, package Singulation, Glass, Ceramic, Quartz, PZT and other Microelectric Components. Our Peripheral Equipment includes Tape Curing, Wafer mounting, Wafer Cleaning, Spindle Chillers, Resistivity Controls, Water Controls, Flanges and Dressing Boards.
Exatron offers a complete line of automated handling, testing, programming, and laser marking equipment for the packaged integrated circuit industry. Device Handlers, Tape and Reel, MEMS Handlers, Laser Markers, Contactors and Pick and Place for device testing.
Air-Vac / Infotech - Robotic Platforms and Automation Solutions including: Micro Dispense, Assembly, Sort, Package, Inspection, Test, Repair, Solder, Weld, Sealing, Micro Paint, Eutectic Bond , Jet Dispense and Power Module assembly.
Separation Technologists, Inc. specializes in recycling and separation system design. With over 50 years of combined engineering experience, they design the most appropriate, effective, and efficient wastewater recycling system or chemical separation system to meet your needs, including: closed-loop recycling systems, water reuse systems, chemical recycling systems and zero-discharge systems.