Boston Micro-Components | Wire Bonders and Die Bonder Sales

Boston Micro-Components is your number one source for growth on the Eastern seaboard and East Canada. We are your go-to company for wire bonders, automation solutions and much more! We represent numerous companies specializing in manufacturing equipment and assembly services. We represent award winning expert manufacturing equipment companies such as Advanced Dicing Technologies, Exatron, Air-Vac Automation and FS Bondtec.

Wire Bonding Machine

A wire bonding machine is an essential tool in semiconductor manufacturing. It automates the process of bonding wires to semiconductor devices, ensuring accuracy and efficiency in production. Modern wire bonding machines offer advanced features for high-speed and high-precision bonding.

Wire Bond Wire

Wire bond wire is a crucial component in the semiconductor industry, used for connecting integrated circuits to substrates. It plays a vital role in ensuring reliable electrical connections within electronic devices.

Wedge Bonding

Wedge bonding is a semiconductor assembly process that involves using a wedge-shaped tool to create bonds between wires and semiconductor devices. This method is widely used for its precision and reliability in manufacturing electronic components.

Wire Bonding Equipment

Wire bonding equipment encompasses a range of tools and materials used in the wire bonding process. This includes bonders, wire pull testers, bond wire materials, and related accessories. Choosing the right wire bonding equipment is crucial for achieving quality bonds and optimizing production processes.

Wedge Wedge Bonding

Wedge wedge bonding is a specialized bonding technique used in semiconductor manufacturing. It involves bonding wires using a wedge tool, ensuring strong and reliable connections. This technique is particularly suited for applications requiring precise bonding and high bond strength.