Automatic Dicing Saws
Fully Automatic Twin Dicing Saws
Fully Automatic Twin Dicing Saws
Fully Automatic Dicing Saw Brochure
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Fully Automatic 12" Twin - 8030 Series​ Dicing Saw

ADT 8030 Dicing system has two facing spindles that can simultaneously dice wafers at high throughput.  ADT 8030 is a high accuracy system that can dice products up to 12” in diameter or 12” × 12” product,  at high performances and low cost of operation.​

FEATURE & BENEFITS
  • Bridge type frame
  • Flexibility - Supports Hub and Hubless blades up to 3” O.D.
  • Dual microscopes, fixed non-contact sensors and two dress stations
  • Spindles of 1.8 KW or 2.2 KW high power (for challenging applications)
  • Superior vision system with continuous zoom magnification
  • Intuitive operation interface using a large 19” touch screen monitor

Automatic 8" & 12" - 7120 / 7130 Series​ Dicing Saw

The 7120 / 7130 family of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility.

With different models to choose from, each optimized for a specific range of applications, the 7120 / 7130 Series covers the widest range of applications, offering the lowest possible cost of ownership while providing the most advanced dicing technology available.

The 7120 / 7130 Dicing System is an industry leading platform designed for a variety of applications such as: ​
  • Ceramic Substrates & Capacitors
  • Glass
  • Automotive Sensors 
  • PZT
  • Glass on Silicon
  • LED & LED on PCB Packages
  • Package Singulation (BGA, QFN)
  • Opto-electronic Components
  • SAW Filters
  • Sensors & MEMS
  • LTCC
  • IC Wafers
Automatic 8
Automatic 8" & 12" Dicing Saw
Fully Automatic 7120-7130 Series Dicing Saw Brochure
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File Type: pdf
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