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Since 1991, Cyntec’s team of scientists and engineers have been known to lead the way in the research and development of the miniaturized and highly integrated products. The product lines consist of power modules, passive components and sensors which serve the appliance, automotive, computer, and communication industries. Using their insight into market trends and the in depth knowledge of electronic materials and processes (thin/thick film technologies), we have been able to produce a wide variety of products with the highest levels of performance, high power handling, high density packaging and tight accuracy.

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​Material:
 Metal oxide
 Rare earth metal oxide
 Nano precious material
 Ceramic and polymer material

Design & Simulation:
 Wide resistance range
 Higher precision
 High power rating
 Lower TCR
 Better heat dissipation
 RF wideband characteristic


Process
 Lift-off technology
 Vacuum sputtering and lithography
 Print, dry and ring technology
 Electronic and electro-less plating
 Laser scribing and slicing technology
 High density terminal technology

Analysis
 Thermal resistance analysis
 ICP and FTIR analysis
 XRD and SEM analysis
 DSC, DTA/TGA and DMA analysis
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