Since 1991, Cyntec’s team of scientists and engineers have been known to lead the way in the research and development of the miniaturized and highly integrated products. The product lines consist of power modules, passive components and sensors which serve the appliance, automotive, computer, and communication industries. Using their insight into market trends and the in depth knowledge of electronic materials and processes (thin/thick film technologies), we have been able to produce a wide variety of products with the highest levels of performance, high power handling, high density packaging and tight accuracy.
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Material:
Metal oxide Rare earth metal oxide Nano precious material Ceramic and polymer material Design & Simulation: Wide resistance range Higher precision High power rating Lower TCR Better heat dissipation RF wideband characteristic |
Process
Lift-off technology Vacuum sputtering and lithography Print, dry and ring technology Electronic and electro-less plating Laser scribing and slicing technology High density terminal technology Analysis Thermal resistance analysis ICP and FTIR analysis XRD and SEM analysis DSC, DTA/TGA and DMA analysis |
