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New England Representation
Your choice for growth in New England
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MANUFACTURING EQUIPMENT

F&K DELVOTEC/FMI High performance automatic and semi automatic die attach and wire bonding equipment Bonders for gold ball, gold wedge, aluminum fine and heavy wire, available for leadframe hybrid COB and MCM applications. Fully intergrated systems with reel to magazine, die attach, bonding and cure ovens. Fully manual non-motorized epoxy die placment machine. Included with the machines are microscope, illuminator, and customized work holder. Visit our WEB Site
SURFECT
Single cell plating tool to improve the speed and quality of
wafer metallization
Visit our Website
KETECA
Advanced dicing solutions and surfactants hub style. Saw blades
with extended wear rates.
Visit our Website
Laser Markers,Automated Handling,
Testing, and Programming Equipment .Test Sockets
www.exatron.com
ADT is a World Leader in the Development and Manufacture of Dicing Saws
and Laser Scribing Systems.Dicing Blades, Wafer Mounting Station, Tape Curing
and Wafer Cleaning Stations.
www.adt-co.com

Full and Semi Automatic Scribers, Breakers and Sorters.
CONTACT US BY E-MAIL
< John Tierney > Cell Phone 781-389-3487
INSIDE SALES
< Debra Tierney >
Boston Micro-Components 65 Cardigan Rd Tewksbury, MA 01876 Phone (978) 640-1980 Fax (978) 640-1968
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