F&K Delvotec








       












                

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New England Representation

Your choice for growth in New England


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MANUFACTURING EQUIPMENT

ELECTRONIC COMPONENTS

ASSEMBLY AND TEST SERVICES

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F&K Delvotec


F&K DELVOTEC

F&K Devotec is the Technology leader in the field of Wire Bonding.
Providing state-of-the-art Bonding equipment for over 25 years.
Fine and Heavy Ribbon,Ball
Bonding, Deep Access and 56XX series 5 in 1 Wire Bonder.

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ADT is a World Leader in the Development and Manufacture of Dicing Saws
and Laser Scribing Systems.Dicing Blades, Wafer Mounting Station,
Tape Curing and Wafer Cleaning Stations.

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Separation Technologists

The Leader in Closed-Loop Water Recycling
AquaCycler Dicing Water Filtration and Recycling System

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  Panasonic Microelectronics

  
Advanced Packaging Lab in Chicago to collaborate with the US-based customers,
Develop a Process know-how for Flip Chip GGI Gold to Gold Interconnect,
Small & Thin Die bonding and Plasma cleaning.

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  Air-Vac Engineering

 
 Multi-functional Cell or Bench top Platforms for High Precision Assembly,
Dispensing, Curing,Inspection,Repair multiple tool changer,
Die flipper, Custom application plates.

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Exatron

Laser Markers,Automated Handling,Testing,
and Programming Equipment .Test Sockets

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McBain Systems

Microscopy, Defect detection, Infrared
Inspection, Mask Alignment Systems,
Probe Card Analysis
and Micro/Macro Inspection

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     MVP 

provides the highest level of Automated
Optical Inspection(AOI) solutions for both
the Semiconductor and SMT assembly processes.Inspects paste and flux, die placement,
components, underfill and wirebands.
The Lowest False Call Rates in the industry.


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CONTACT US BY E-MAIL

< John Tierney >

Boston Micro-Components
65 Cardigan Rd
Tewksbury, MA 01876

Cell Phone 781-389-3487
Fax(978)640-1968
jtbmc@comcast.net


INSIDE SALES

< Debra Tierney >
Boston Micro-Components
65 Cardigan Rd
Tewksbury, MA 01876

Fax (978) 640-1968
       dtbmc@comcast.net