F&K Delvotec




       










                




JFP Micro technic


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New England Representation


Your choice for growth in
New England


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MANUFACTURING EQUIPMENT





F&K Delvotec

F&K DELVOTEC/FMI
High performance automatic and semi automatic
die attach and wire bonding equipment
Bonders for gold ball, gold wedge, aluminum fine and heavy wire,
available for leadframe hybrid COB and MCM applications.
Fully intergrated systems with reel to magazine,
die attach, bonding and cure ovens.
Fully manual non-motorized epoxy die placment machine. Included
with the machines are microscope, illuminator, and customized work holder.
Visit our WEB Site
 
 
 
 
SURFECT
Single cell plating tool to improve the speed and quality of
wafer metallization
Visit our  Website
 
 
 
 
 
KETECA
 Advanced dicing solutions and surfactants hub style. Saw blades
with extended wear rates.
Visit our Website
 
 
 
 
 
 
 
 
 
 Laser Markers,Automated Handling,
Testing, and Programming Equipment .Test Sockets
www.exatron.com 
 
 
 
ADT is a World Leader in the Development and Manufacture of Dicing Saws
and Laser Scribing Systems.Dicing Blades, Wafer Mounting Station, Tape Curing
and Wafer Cleaning Stations.
www.adt-co.com
 
 
 
 
 
 
 
 
 



JFP Micro technic

Full and Semi Automatic Scribers, Breakers and Sorters.

 

 

 

 





CONTACT US BY E-MAIL

< John Tierney >
Cell Phone 781-389-3487

INSIDE SALES

< Debra Tierney >


Boston Micro-Components
65 Cardigan Rd
Tewksbury, MA 01876
Phone (978) 640-1980
Fax (978) 640-1968





WEB Site designed by Paul Iannazzo
E-mail pmiproducts@msn.com