CLEAN ROOM

The clean room contains all aspects for assembling DC, RF, High frequency, Millimeter-wave products. The processes includes board mount, component mount, small hand soldering through wire bonding, incapsulation and final inspection.

WIRE BONDING

Our wire and ribbon bonding capabilities consist of manual gold ball bonding and wedge using both thermosonic and thermocompression fine wire from .0007 to .001, and ribbon from .001 to 20 X 1/2.

DIE BONDING

Die attach capabilities are eutectic, conductive and non-conductive epoxies. The components we handle are from a 10X10 mil. chip, and as small as a 0401 for surface mount.

SEALING

We also have a BTU MTC-1 four zone furnace with nitrogen purge capabilities to 25 PSI.

SURFACE MOUNT ASSEMBLY

Our Capabilities also include soldering of all surface mount PC boards and through hole assemblies. The equipment used are hand held dispensers to apply solder paste and can also be used to apply epoxies.